Cooling & Thermal Solutions

Cooling & Thermal Solutions

AEONS LIQUID/HYBRID COOLING SOLUTIONS

With the growing demands of high-performance computing and AI workloads, Aeons provides comprehensive solutions and services for liquid and hybrid cooling. In partnership with AGT, which brings over 35 years of thermal expertise and more than 1,000 successful industrial installations, Aeons delivers energy-efficient, low-downtime, and future-proof cooling solutions for enterprise, hyperscale, and edge deployments.


Our flagship Borealis™ CDU system offers facility-to-chip unified control, modular scalability from 200–400 kW up to 1.6 MW+, industrial-grade reliability, predictive AI diagnostics, and open integration protocols (BACnet, Modbus, SNMP, API). Its modular design allows rapid deployment, seamless expansion, and minimal downtime, with front-access service for routine IT loop maintenance and rear-access for less frequent facility loop tasks.


ThermaPod™ pilot solutions expand innovation into modular immersion and direct-to-chip cooling, providing next-generation thermal performance for customers seeking cutting-edge, high-density cooling technologies.

Your Partner in Critical Digital Infrastructure

Today’s IT environments are more distributed and complex than ever. We connect and protect your infrastructure from core to edge—ensuringseamless performance, resilience, and continuous operation without compromise.

Key Benefits

• Facility-to-Chip orchestration for unified management and predictive maintenance

• Modular scalability allowing plug-and-play expansion without major piping or shutdowns

• Industrial reliability using field-proven pumps, stainless steel construction, and N+1/2N redundancy
• Open protocols and integrator-friendly design for seamless BMS/DCIM integration
• Front-access serviceability for IT loops, with scheduled rear access for primary facility loops.


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ThermoPod - Adaptable AI/HPC Cooling

  • Two-Phase Immersion - Proof-Primary Condesnsor; Other panels assist
  • Two-Phase Spray - Roof becomes primary condensor; othe panels assist.
  • Direct-to-Chip - Roof becomes micro AC

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aisle containment solutions

Looking to improve efficiency with hot and cold aisle containment? Discover our tailored solutions designed to maximize airflow, reduce energy costs, and protect your critical IT equipment.

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