AI and high-performance computing are transforming data centers by driving power density and heat to levels that traditional cooling methods cannot handle. These workloads require infrastructure that can scale, cool efficiently, and protect uptime. Aeons addresses these needs with advanced racks and enclosures designed for airflow optimization, seismic protection, and our leading-edge liquid cooling and direct-to-chip cooling technology. These solutions ensure customers are ready for the AI-driven era today, not tomorrow.

Transforming a data center infrastructure typically means upgrading hardware, optimizing network architecture, adopting virtualization and cloud-based solutions, and integrating modern technologies like automation, AI, and edge computing to improve performance, scalability, and resilience.

We provide a full range of infrastructure solutions, including high-capacity server racks, networking cabinets, cooling systems, aisle containment, wire & cable management systems, cooling units, and power management equipment.

Customers face three interconnected challenges. The first is power density, as AI and high-performance computing demand more watts per rack. The second is cooling since legacy air-based solutions  (air cooling systems) cannot efficiently handle today’s heat loads. The third is scalability, because infrastructure must expand quickly and cost-effectively without creating bottlenecks. Aeons solves these issues with direct-to-chip liquid cooling (advanced liquid and hybrid cooling solutions), modular high-capacity racks that are lighter yet stronger, and customizable enclosures that can be delivered in as little as 15 to 30 days, helping customers scale seamlessly.

Today’s workloads require innovation, speed, and cost efficiency all at once. Aeons provides up to 40 percent cost savings compared to competitors, industry-leading delivery times as fast as two days, and advanced solutions such as liquid cooling, airflow-optimized enclosures, and modular racks. Customers turn to Aeons because we help them keep pace with the explosive growth of AI and high-density computing while staying within budget and timeline.

Aeons’ core strength is the ability to integrate innovation, performance, and customization. Our racks are 25 percent lighter yet 25 percent stronger than traditional models. Our enclosures feature advanced airflow management, tool-free assembly systems, and seismic protection. Most importantly, we are leading in thermal solutions with liquid cooling and direct-to-chip cooling hybrid cooling technology, ensuring customers can operate at maximum density without compromising efficiency.

Customization is at the center of Aeons’ approach. With 25 years of expertise and advanced automation, we are able to make the process fast and seamless. Modified designs can be prototyped in 15 days, while new designs can move from concept drawings to approval in less than 30 days. Combined with our portfolio of more than 1,000 models, this gives customers tailored solutions without delays to their project timelines.